在真空镀膜和沉积系统等充满颗粒物的复杂环境中，使用隔离阀调节流量时，往往会因物质堆积而导致流导受限。传统的工业阀门设计往往结构笨重，且未能从根本上解决导致上述问题的设计缺陷。

ANCORP 专门设计了一款高流导球阀，旨在解决高颗粒度真空环境下大口径真空管路所面临的这些挑战。

尽管不同应用场景对污染的容忍度各不相同，但诸如 PVD（物理气相沉积）、CVD（化学气相沉积）、ALD（原子层沉积）及溅射等真空镀膜与沉积工艺，均依赖于气体流量、真空度和温度之间的精确平衡。系统中的每一个组件（包括阀门）都在维持这种平衡中发挥着关键作用。

这种优化过程在很大程度上聚焦于“流导”的提升。

选择能够实现流导最大化的组件，往往决定了系统是处于效率低下的困境，还是能够始终如一地提供高质量的工艺结果。它直接影响着抽速、压力稳定性和工艺性能。

在真空管路中，使用高流导（HC）球阀是保持良好流导的有效途径。

ANCORP 的高流导（HC）高真空球阀是半导体制造中的关键组件。该阀门可提供极高的流导，对于维持系统内的高真空度至关重要。它采用了优化的平滑轮廓、全通径球体，以及缩短了整体长度的两片式 316L 不锈钢阀体，从而最大限度地提升了阀门与加热组件之间的热传递效率。鉴于不同工艺对加热的需求各异，HC 阀门的阀体密封圈和阀杆密封圈均可根据客户的具体应用需求进行更换。

Dirty, particle-rich environments such as those found in vacuum coating and deposition systems frequently encounter problems with buildup and restricted conductance when regulating flow with isolation valves. Traditional industry valve solutions offer bulky designs without addressing the design features contributing to these issues.

At ANCORP designed a high conductance ball valve to address these challenges for large-diameter vacuum lines in high particulate vacuum environments.

While other system applications may have different contamination allowances, vacuum coating and deposition techniques such as PVD, CVD, ALD, and sputtering all rely on a careful balance of gas flow, vacuum level, and temperature for proper operation. Every component in the system plays a role in achieving that balance including valves.

A large part of this optimization dials in on conductance.

Choosing components that maximize conductance can be the difference between a system that struggles with efficiency and one that consistently delivers high-quality results. It directly influences pumping speed, pressure stability, and process performance. 

An effective way to maintain good conductance in a vacuum line is with the use of a high conductance (HC) ball valve.

ANCORP’s High Conductance (HC) high vacuum ball valve is a critical component in semiconductor manufacturing. This valve provides maximum conductance, which is important in maintaining high vacuum levels in the system. With improved smooth contours, a fully ported ball, and a reduced overall length two-piece 316L stainless steel body heat transfer capabilities are maximized between the valve and heating components. As heating demands differ across specific processes, body and stem seals for the HC valve can be changed to meet the needs of customer applications.

高导流球阀是一种专门设计的隔离阀，旨在最大限度地降低流动阻力和颗粒积聚。

该系列阀门最大尺寸可达 4 英寸，适用于大口径管道系统。它在 ANCORP 经典标准球阀的基础上进行了升级，针对那些对“导流能力”（即流体通过能力）有极高要求的应用场景，采用了专门的优化设计。

与 ANCORP 的标准球阀一样，高导流球阀（HC 系列）拥有坚固的阀体、阀杆、带通孔的球芯以及法兰端盖。此外，它还配备了专利的“长寿命密封件”（Extended Life Seal），确保在真空环境下也能提供持久、可靠的性能。

高导流球阀有何独特之处？该阀门经过精心设计，通过精确的尺寸调整，实现了导流能力的提升、流动阻力的最小化以及维护流程的简化。具体设计特点包括：

• 全通径球芯通道 —— 形成畅通无阻的直通式流道，保持管径一致，实现流量最大化。

• 缩短阀体长度 —— 缩短了流体路径，根据导流公式，有效降低了流动阻力。

• 平滑的内部轮廓 —— 消除了可能导致湍流或“冷点”的突变结构，从而改善了流体流动和热传递效果。

• 两段式阀体结构 —— 减少了一个潜在的泄漏点；在使用全氟弹性体（FFKM）密封材料时，可大幅降低维护成本。

• 平滑的外形轮廓 —— 最大限度地提升了来自加热组件的热传递效率。

A high conductance ball valve is a specialized isolation valve engineered to minimize flow resistance and particle buildup.

Available in sizes up to 4 inches for large-diameter piping, the high conductance valve builds on the foundation of ANCORP’s iconic standard ball valve while introducing a specialized design for applications where conductance is a priority.

Like ANCORP’s standard ball valves, HC valves are built with a robust body, stem, ported ball, and flanged end caps. They also come equipped with the patented Extended Life Seal, which provides long-lasting, reliable performance under vacuum conditions.

What sets the high conductance valve design apart? This valve has been thoroughly engineered with precise dimensional adjustments that improve conductance, minimize resistance, and simplify maintenance. These designs include…

• Fully bored ball port – creates an unimpeded, straight-through channel that maintains diameter and maximizes flow.

• Reduced body length – shortens the flow path, minimizing resistance in line with the conductance formula.

• Smooth internal contours – eliminates abrupt transitions that would otherwise create turbulence or cold spots, improving both flow and heat transfer.

• Two-piece body – one less potential leak path & huge maintenance cost reductions when using perfluoroelastomers.

• Smooth profile – maximizes heat transfer from heating components.

通过精简阀体结构并重新设计内部流道，高流导球阀为气体分子构建了一条更平直、更直接的通道。这种设计显著提升了流导性能，对于那些高度依赖流体效率的镀膜与沉积系统而言，是一项至关重要的优化措施。

采用两片式阀门结构，减少了阀门内部潜在的泄漏路径。通过省去一个阀体O型密封圈，不仅降低了泄漏风险，还大幅削减了全氟弹性体（FFKM）密封件的维护成本。

通过优化上述要素，高流导阀门改善了分子流动特性及几何结构。

简而言之，鉴于“流导”这一概念描述了气体分子在真空系统各部件中流动的难易程度，对阀门进行了全面优化，旨在最大限度地降低流动阻力。这直接助力于缩短抽气时间、实现更稳定的腔体压力，并提升镀膜与沉积工艺的生产效率。

By reducing the body and redesigning the internal flow path, high conductance ball valves create a straighter, more direct channel for gas molecules to pass through. This results in improved conductance, making it an essential optimization for coating and deposition systems where flow efficiency is critical.

With two-piece valve construction, we have reduced the number of potential leak paths within the valve. Through one less body O-ring seal, leak potential is reduced, and you can benefit from huge reductions in perfluoroelastomer maintenance costs.

By improving these factors, high conductance valves enhance molecular flow and through geometry.

In simple terms, with conductance describing how easily gas molecules move through a part of the vacuum system, we’ve optimized the valve completely to maintain flow as easily as possible. This directly supports faster pump-down times, more stable chamber pressures, and higher throughput in coating and deposition processes.

在真空镀膜与沉积工艺中，环境条件较为严苛；残留颗粒、可凝性蒸汽以及薄膜堆积等问题，要求必须对污染进行严格管控，并做好设备维护。在这些系统中，最大化“流导”（conductance）具有多项直接优势：

• 提升工艺效率——缩短抽气时间和工艺循环周期，从而提高生产吞吐量。

• 改善薄膜均匀性——稳定的压力和均匀的气体输送，有助于提升镀膜质量。

• 减少停机时间——采用平滑轮廓和较短结构长度设计的阀门，更易于维护，且不易发生物质堆积。

• 延长系统使用寿命——高流导设计可减轻泵及其他下游组件的负荷，从而延长关键硬件的使用寿命。

这些优势使得高流导（HC）球阀在诸如原子层沉积（ALD）等先进沉积工艺中极具价值——在这些工艺中，对薄膜层数的精确控制至关重要；同时，在高产能的物理气相沉积（PVD）系统中，高流导设计也有助于提升效率，进而增加盈利能力。在高吞吐量的生产环境中，通过采用更大通径的阀门来保持高流导，可有效防止材料堆积，从而避免因频繁维护而缩短设备维护周期。

Vacuum coating and deposition are challenging environments where residual particulates, condensable vapors, and film buildup demand careful contamination and maintenance control. In these systems, maximizing conductance has several direct benefits:

• Process efficiency – faster pump–down time and cycle times translate to higher production throughput.

• Film uniformity – stable pressure and consistent gas delivery improve coating quality.

• Reduced downtime – valves designed with smooth contours and shorter lengths are easier to maintain and less prone to buildup.

• System longevity – by reducing strain on pumps and other downstream components, high-conductance designs extend the operating life of critical hardware.

These advantages make HC ball valves particularly valuable in advanced deposition methods like ALD, where precise layer control is essential, and in high-volume PVD systems, where efficiency drives profitability. In high-throughput environments, maintaining conductance through larger valve diameters prevents material buildup that can shorten maintenance cycles.

在半导体制造过程中，最大的挑战之一是副产物（如金属颗粒）在辅助设备区（subfab）真空管路中的沉积与堆积。如果处理不当，这不仅会降低系统效率，最终还可能导致系统故障。

幸运的是，ANCORP 的球阀设计能够有效应对这一问题。阀球由聚四氟乙烯（PTFE）阀座密封并固定；在阀门动作过程中，它能实现自清洁功能，从而减少阀球表面的物理杂质。如果杂质在阀门内表面持续堆积，阀门就需要频繁进行维护。此外，ANCORP 的球阀（尤其是高流导型球阀）支持加热功能，这也有助于防止杂质堆积——通过高效的热传递，阀门能够有效避免冷凝现象的发生。

ANCORP专利的阀杆密封设计进一步缓解了频繁维护带来的挑战。该设计确保了阀杆的充分稳固，减少了潜在的泄漏路径，并优化了阀门的动作性能。这一工程解决方案将阀杆密封的使用寿命延长了十倍，减少了阀门维护需求，从而有助于确保生产的连续性，并将对制造流程的干扰降至最低。

在辅助设备区（subfab）系统中，XL 系列球阀发挥着至关重要的作用：它不仅能为工艺设备的排气管路和真空管路提供有效的真空隔离，还能最大限度地减少维护需求，确保半导体器件生产的高效与可靠。

One of the biggest challenges in semiconductor fabrication is the deposition and buildup of byproducts, such as metal particles, on vacuum lines in subfab systems. This can cause reduced efficiency and eventual system failure if not managed properly.

Fortunately, ANCORP’s ball valve design can help tackle this issue. The valve ball is sealed and held in place by PTFE seats, and when the valve is actuated, it completes a self-cleaning function that reduces physical debris on the ball. If debris were to continue to build on the valve’s inner surface area, the valve would need to be serviced frequently. The issue of debris is also prevented by the ball valves ability to be heated, especially the high conductance valves. With high heat transfer capabilities, the valves reduce buildup by preventing condensation.

The challenge of frequent servicing is further mitigated by ANCORP’s patented stem seal design. The stem is fully stabilized, reducing potential leak pathways and improving valve actuation. This engineered solution extends stem seal life by ten times and reduces the need for valve maintenance by helping to ensure consistent production and minimize disruptions to the manufacturing process.

In subfab systems, the XL ball valve plays an essential role in providing effective vacuum isolation on the exhaust lines and vacuum lines of process tools, as well as in minimizing maintenance requirements and ensuring efficient and reliable semiconductor device production.

ANCORP成立于1965 年，是一家专注于高真空（HV）与超高真空（UHV）组件领域的美国企业。专注于高真空及超高真空（UHV）领域。公司主营产品涵盖真空腔体与定制加工、真空阀门、法兰、接头、穿通件与观察窗、过滤器等，其中高真空球阀是行业的创新产品。ANCORP 的产品广泛应用于半导体制造、真空镀膜与沉积、研发与科学实验、航空航天，以及工业热处理、低温技术、能源与医疗等领域。

作为行业领先的高端工业产品一站式服务平台 —— 爱泽工业，我们专注于为半导体制造、航空航天、真空镀膜、通用制造及前沿科研领域提供相对全面的真空硬件。

我们深度整合欧美真空品牌的优质资源，汇聚包括瑞士 VAT、德国 Pfeiffer Vacuum、美国 Kurt J. Lesker、MKS Instruments、Nor-Cal以及 ANCORP 等全球知名品牌。产品线覆盖高真空（HV）与超高真空（UHV）领域的组件——从高精度真空闸阀、角阀、多通道阀，到 ConFlat (CF)、KF、ISO 标准法兰管件，再到真空管道、穿通件、观察窗及捕集器等全系硬件。

凭借严苛的品控体系、丰富的现货库存与专业的工程技术支持，我们协助客户降低采购成本、缩短交付周期。无论是工业 OEM 的批量采购，还是科研机构的个性化需求，我们均能提供相应匹配的产品与服务。

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