M-BOND 610 Adhesiveion milling, cross-sectioning
This is a nonconductive, two-component, solvent-thinned, epoxy-phenolic adhesive for high performance applications. Chemically resistant and provides a thin layer of glue which has good ion milling properties. It has low viscosity and is extremely thin, with minimum creep, hysteresis and linearity problems. Solids content is 22%. It is an excellent adhesive for mounting samples for TEM dimpling and bonding of samples to TEM grids for imaging or FIB.
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Operating temperature range, short term is -269° to +370°C; long term, -269° to +260°C. Elongation can occur at +24°C (3%). This may be the widest temperature range general-purpose adhesive that is available. A kit contains: 4 bottles (14g each) Resin, 4 bottles (11g each) Curing Agent, 4 brush caps for dispensing mixed adhesives, 4 disposable mixing funnels and instructions. |