Thiskitincludesthetoolsandmaterialsneededtoreliablyrepairorreplacedamagedlands,surfacemount,andBGApads. Thereplacementcircuitsinthiskithaveadryfilm,adhesivebackingthatisactivatedandcuredwithheat.ThisIPCrecommendedrepairmethodrestoresyourboardstotheiroriginallevelofperformanceandreliability. Includesatemperature-controlledBondingIronandBondingTipstodeliverstheoptimalheatrequiredforcuringtheadhesivebondingfilmonthebacksideofthereplacementlandsandpads. Thiskitisspecificallydesignedtomaketherepairprocessassimpleandreliableaspossible.AllthetoolsandmaterialsarepackagedinaruggedESDsafecarryingcase. | Thiskitincludesthetoolsandmaterialsneededtoreliablyreplacedamagedlands,surfacemount,andBGApads. | |