Manual sectioning saw designed for cutting printed circuit boards, ceramics, ｍmbedl samples and composite components. Can also be used as a cut-off saw for small rods, wires, bars and tubes. Large working area of 6 x 10" with coolant bath below. The saw housing and table are made of non-corroding sturdy cross linked polyethylene to ensure durability. Powerful 1/4 HP (115V/1.75A/200W) motor with approximate variable speed of 700-2800 rpm, allows for selecting the best cutting speed for a variety of sample materials. Uses 4 and 5" diamond wafering blades with 5/8" (16mm) holes.

Includes: 4" Diamond Wafering Blade with medium/coarse grit in high concentration (#812-316-5), Dressing Stick and Water Soluble Coolant.

Maximum cutting width: 3-1/2"
Maximum cutting depth: 4" blade = 1"; 5" blade = 1-1/2"