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更新时间:2026/10/14 9:22:22关注度:1470
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PELCO® High Performance Silver PasteSilver flakes in an inorganic silicate aqueous solution, specially formulated adhesive for demanding bonding applications such as:
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The excellent thermal and electrical conductivity, coupled with the absence of hydrocarbons, makes this product ideal for demanding specimen preparation in FESEM, XPS, ESCA, SIMS, Auger and other applications. PELCO® High Performance Silver Paste provides both high electrical and thermal conductivity with a silver particle size of 20µm. Silver content >60% by weight. Cures at room temperature, but requires a 2 hour cure at 93°C (200°F) to achieve high conductivity and strong bond. Must be fully cured before using this product at cryogenic temperatures. Soluble in water to 260°C (500°F). Above this temperature it becomes almost insoluble. | |
| 订货编号 | 规格 |
| 16047 | 银胶,50g |
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