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更新时间:2026/10/14 9:22:22关注度:1414
关键词标签:EMS胶黏剂12671-20E,Epo-Tek,H20E,,Adhesive,美国EMS授权代理商
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Epo-Tek H20E is a two component, 100% solid silver-filled epoxy system, silver-resin paste and liquid hardener, mixing ration is 1:1.
Epo-Tek H22E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400°C)
Epo-Tek H20E is also a conductive adhesive of choice for old or new applications
Its applications include: chip bonding and electronic bonding as well as SEM mounting
H20E contains no solvents and will not outgas
When cured, H20E isl resistant to solvents, resin and moisture
Long Pot life (2½ days)
Shelf life is one year when store at 23°C
| 175°C | 45 seconds |
| 150°C | 5 minutes |
| 120°C | 15 minutes |
| 80°C | 3 hours |
| Physical Properties | ||
| Color: | Part A: silver; Part B: silver | |
| Consistency: | Smooth, thixotropic paste | |
| Viscosity (@ 100 RPM / 23°C): | 2,200-3,200 cPs | |
| Thixotropic Index: | 3.69 | |
| Glass Transition Temp (Tg): | ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) | |
| Coefficient of Thermal Expansion (CTE): | Below Tg: 31 x 10-6 in/in/°C Above Tg: 158 x 10-6 in/in/°C | |
| Shore D hardness: | 75 | |
| Lap Shear Strength @ 23°C: | 1,475 psi | |
| Die Shear Strength @ 23°C: | >5 kg / 1,700 psi | |
| Degradation Temp (TGA): | 425°C | |
| Weight Loss: | @ 200°C: 0.59% @ 300°C: 1.67% @ 250°C: 1.09% | |
| Operating Temp: | Continuous: -55°C to 200°C Intermittent: -55°C to 300°C | |
| Storage Modulus @ 23°C: | 808, 700 psi | |
| Thermal Resistance: (Junction to Case): | TO-18 package with nickel-gold metalized 20 x 20 mil chips and bonded with Epo-Tek H20E (2 mil thick) Epo-Tek®H20E: 6.7 to 7.0°C/W Solder: 4.0 to 5.0°C/W | |
Technical Data Sheet
| Cat # | Description | Pack |
|---|---|---|
| 12671-20E | Epo-Tek H20E Adhesive | 1 oz |
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